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For full Warranty details please refer to the product profile!

 

 

Electronic Packaging Material - Potting and Encapsulating Gels


Details: EPM-2481 - Tough Firm Gel

Product Profile: EPM-2481P.pdf
MSDS PDF A: EPM2481A.pdf
MSDS PDF B: EPM2481B.pdf
Basic Product Overview:
Section: Electronic Packaging Material
Description: Potting and Encapsulating Gels
NuSil ID: EPM-2481
Viscosity A:
Viscosity B:
Viscosity Mixed:
Flow/Viscosity: A:15,000 / B:9,000
Cure System: Platinum Addition
Solids Content:
Work Time: 1 D
Cure Time/Temp: 30 m / 150
Post Cure Time/Temp:
Specific Gravity:
Durometer Type A Certified:
Durometer Type A Typical: Very Firm
Tensile psi Certified:
Tensile psi Typical:
Tensile MPa Certified:
Tensile MPa Typical:
Elongation Percent Certified:
Elongation Percent Typical:
Tear PPI Certified:
Tear PPI Typical:
Tear kN/m Certified:
Tear kN/m Typical:
Ionic Content* CI - K / Na ppm <5 / <1 / <2
Lap Shear psi/Mpa:
Volume Resistivity** ohm·cm 1 x 1014
Dielectric Strength V/mil:
Operating Temp: -65 to 250
Plasticity/Viscosity/Extrusion Typical:
Stress Strain:
Mix Ratio: 1:1
Colour: Trans
Comments: Tough Firm Gel

 

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Back Please note:
Alternative sizes and packaging can and may be supplied, subject to availability of stock.
Products pictured may vary and illustrations are for guidance only!
 
       
       


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