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For full Warranty details please refer to the product profile!
Engineering Materials - General Purpose - Potting and Encapsulating Materials for Electronics
Details: R-2165 - Enhanced thermal conductivity for removal of heat and improved reliability
| Product Profile: | R-2165.pdf |
|---|---|
| MSDS PDF A: | en_gb_sds_nusir-2165.pdf |
Basic Product Overview: |
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| Section: | Engineering Materials - General Purpose |
| Description: | Potting and Encapsulating Materials for Electronics |
| NuSil ID: | R-2165 |
| Cure System: | Platinum |
| Work Time: | 10 M |
| Cure Time/Temp: | 10 M / 150°C |
| Durometer Type A Typical: | 60 |
| Tensile psi Typical: | 500 |
| Tensile MPa Typical: | 3.4 |
| Elongation Percent Typical: | 100 |
| Mix Ratio: | 1:1 |
| Colour: | Gray |
| Comments: | Enhanced thermal conductivity for removal of heat and improved reliability |
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Back | Please note: Alternative sizes and packaging can and may be supplied, subject to availability of stock. Products pictured may vary and illustrations are for guidance only! |
