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Potting and Encapsulating Materials for Electronics

Engineering Materials - Selection Guide
General Purpose - Engineering Standard Silicone Potting and Encapsulation for Electronics


NuSil ID Cure System
Work Time
Mix Ratio
R-2165 Platinum 10 M 1:1 Enhanced thermal conductivity for removal of heat and improved reliability
R-2175 Platinum 1 H 1:1 Thermally conductive silicone potting elastomer cures at room temperature
R-2188 Platinum 8 HR + 1:1 Pourable and self-leveling Cures at lower temperatures (≥70°C)
R-2613 2 HR 10:1 Pourable and self-leveling Cures at room temperature




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