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Electronic Packaging Material - Potting and Encapsulating Materials


Details: EPM-2420 - Low Viscosity, Self-leveling Adhesive to Polyester and Polyether


Product Profile: EPM-2420.pdf
MSDS PDF A: EPM-2420_EU_English.pdf
Basic Product Overview:
Section: Electronic Packaging Material
Description: Potting and Encapsulating Materials
NuSil ID: EPM-2420
Cure System: Platinum Addition
Cure Time/Temp: 1 h / 65
Specific Gravity: 1.01
Durometer Type A Typical: 30
Tensile psi Typical: 425
Tensile MPa Typical: 2.9
Elongation Percent Typical: 150
Ionic Content* CI - K / Na ppm <2 / <1 / <8
Operating Temp: -50 to 250
Mix Ratio: 1:1
Colour: Trans
Comments: Low Viscosity, Self-leveling Adhesive to Polyester and Polyether

 

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Back Please note:
Alternative sizes and packaging can and may be supplied, subject to availability of stock.
Products pictured may vary and illustrations are for guidance only!

 



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