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For full Warranty details please refer to the product profile!
















 

 

 

Electronic Packaging Material - Potting and Encapsulating Gels


Details: EPM-2480 - Useful for Potting Intricate Assemblies Due to Low Viscosity


Product Profile: EPM-2480.pdf
MSDS PDF A: EPM-2480_EU_English.pdf
Basic Product Overview:
Section: Electronic Packaging Material
Description: Potting and Encapsulating Gels
NuSil ID: EPM-2480
Flow/Viscosity: 2,500 cP
Cure System: Platinum Addition
Work Time: >30 HR
Cure Time/Temp: 30 m / 150
Durometer Type A Typical: Firm Gel
Ionic Content* CI - K / Na ppm <5 / <1 / <2
Volume Resistivity** ohm·cm 1 x 10<sup>14</sup>
Operating Temp: -50 to 250
Mix Ratio: 1:1
Colour: Trans
Comments: Useful for Potting Intricate Assemblies Due to Low Viscosity

 

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Back Please note:
Alternative sizes and packaging can and may be supplied, subject to availability of stock.
Products pictured may vary and illustrations are for guidance only!

 



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