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For full Warranty details please refer to the product profile!
















 

 

 

Engineering Materials - General Purpose - Potting and Encapsulating Materials for Electronics


Details: R-2165 - Enhanced thermal conductivity for removal of heat and improved reliability


Product Profile: R-2165.pdf
MSDS PDF A: en_gb_sds_nusir-2165.pdf
Basic Product Overview:
Section: Engineering Materials - General Purpose
Description: Potting and Encapsulating Materials for Electronics
NuSil ID: R-2165
Cure System: Platinum
Work Time: 10 M
Cure Time/Temp: 10 M / 150°C
Durometer Type A Typical: 60
Tensile psi Typical: 500
Tensile MPa Typical: 3.4
Elongation Percent Typical: 100
Mix Ratio: 1:1
Colour: Gray
Comments: Enhanced thermal conductivity for removal of heat and improved reliability

 

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Back Please note:
Alternative sizes and packaging can and may be supplied, subject to availability of stock.
Products pictured may vary and illustrations are for guidance only!

 



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